AOI金線檢測(cè)機(jī)用于檢測(cè)封裝芯片上的金線連接質(zhì)量和準(zhǔn)確性。使用高分辨率2D/3D相機(jī)和AI圖像處理算法，對(duì)封裝芯片上的金線連接進(jìn)行快速、精確的檢測(cè)和分析。能夠檢測(cè)金線的焊接情況、位置、高度、偏移等參數(shù)，識(shí)別多種異?；蛉毕荩绾附硬涣?、斷裂、偏移等問題。通過(guò)及時(shí)發(fā)現(xiàn)和修復(fù)金線連接的問題，有助于提高封裝芯片的質(zhì)量和可靠性，降低芯片的不良率。
漏打線、打錯(cuò)線、飛線、打雙線、線弧不良、金線殘留、金線短路、焊球脫落、魚尾脫落、焊球XY尺寸、焊球偏移、魚尾XY尺寸、魚尾偏移、有線無(wú)球、電容脫落、電容偏移、立碑、電容臟污、驅(qū)動(dòng)C破損、驅(qū)動(dòng)IC脫落、驅(qū)動(dòng)IC臟污、感光芯片刮傷、感光芯片破損、感光芯片臟污。
Missed Bonds, Misplaced Bonds, Wire Fly, Double Bonds, Wire Arc Defects, WireResidue. Wire Short, Ball Lift. Tail Lift, Ball Offset, Tail Offset,Driver lC Damage, DriverIC Contamination.
獨(dú)特的光學(xué)系統(tǒng)和檢測(cè)算法，用于高速、高靈敏度的晶體缺陷檢測(cè)和分類。
The unique optical system and detection algorithmsare employed for high-speed, high-sensitivity crystal defect detection andclassification.
2D&3D可選，3D測(cè)量Z向精度可達(dá)8um/ Optional2D &3D。
With 3D measurement achieving Z-axis accuracy up to 8um.
UPH：=5000pcs/h
尺寸/Size: L1000*W800*H1500mm
功率/Power：2KW，AC220V
重量Weight：800KG
AOI金線檢測(cè)機(jī)用于檢測(cè)封裝芯片上的金線連接質(zhì)量和準(zhǔn)確性。
The AOl wire bonding inspection machine is used to detect the quality and accuracy of wire connections onpackaged chips.
使用高分辨率2D/3D相機(jī)和AI圖像處理算法，對(duì)封裝芯片上的金線連接進(jìn)行快速、精確的檢測(cè)和分析。能夠檢測(cè)金線的焊接情況、位置、高度、偏移等參數(shù)，識(shí)別多種異?；蛉毕?，如焊接不良、斷裂、偏移等問題。
High-resolution 2D/3D cameras and Al image processing algorithms, the system performs rapid and precisedetection and analysis of wire connections on packaged chips. lt can detect parameters such as wire bondingcondition, position, height, and offset, and identify many anomalies or defects such as poor bonding, breakage or misalignment.
通過(guò)及時(shí)發(fā)現(xiàn)和修復(fù)金線連接的問題，有助于提高封裝芯片的質(zhì)量和可靠性，降低芯片的不良率。
By promptly identifying and repairing issues with wire connections, it helps to improve the guality and reliabilityof packaged chips, reducing the defect rate of the chips.
